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Xu GAOInstitute of Functional Nano & Soft Materials (FUNSOM), Soochow University.Verified email at suda.edu.cn
Jianlong XuInstitute of Functional Nano & Soft Materials, Soochow UniversityVerified email at suda.edu.cn
Changhai Liu(刘长海)常州大学材料科学与工程教授Verified email at cczu.edu.cn
Qi-Jun SunGuangdong University of Technology; City University of Hong KongVerified email at my.cityu.edu.hk
Kazuhito TsukagoshiWPI-MANA, National Institute for Materials Science (NIMS)Verified email at nims.go.jp
Baohua MaoSoochow University, Lawrence Berkeley National LabVerified email at mail.sim.ac.cn
Takeo MinariNational Institute for Materials Science (NIMS)Verified email at nims.go.jp
Tetsuhiko MiyaderaNational Institute of Advanced Industrial Sicence and Technology(AIST)Verified email at aist.go.jp
yan yanShenzhen UniversityVerified email at szu.edu.cn
Zhi LiuSPST, ShanghaiTech University & SIMIT, CASVerified email at shanghaitech.edu.cn
T. K. ShamWestern University (University of Western Ontario)Verified email at uwo.ca
Baoquan SunSoochow University, Institute of Functional Nano & Soft Materials (FUNSOM)Verified email at suda.edu.cn
Wanli MaProfessor, Institue of Functional Nano & Soft Materials (FUNSOM), Soochow University, ChinaVerified email at suda.edu.cn
zhenhui kang苏州大学/东北师范大学Verified email at suda.edu.cn
Jun PengPhD, Soochow University, Australian National UniversityVerified email at suda.edu.cn
Meng ZHANGShenzhen UniversityVerified email at szu.edu.cn
Xueliang SunProfessor of the University of Western Ontario, Canada Research Chair, FCAE, FRSCVerified email at eng.uwo.ca
Hai-Qiao WangNingbo Institute of Materials Technology and Engineering, Chinese Academy of SciencesVerified email at nimte.ac.cn
Mario LanzaIEEE Fellow | Associate Professor at National University of SingaporeVerified email at kaust.edu.sa
Kaichen ZhuKing Abdullah University of Science and Technology, University of BarcelonaVerified email at kaust.edu.sa
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Sui-Dong Wang
Professor, Institute of Functional Nano & Soft Materials (FUNSOM),Soochow University
Verified email at suda.edu.cn